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Specifications:
Board layer: 4
Material: FR-4
Minimum board thickness: 0.6mm
Minimum line
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Specifications:
Board layer: 1
Material: FR-4
Minimum board thickness: 0.6mm
Minimum line
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Bluetooth project: BC4 audio ROM project
Bluetooth chip: BC413159A06
Work frequency: ISM 2.4GHz-2
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Bluetooth project: BC4 audio ROM project
Bluetooth chip: BC213159A20
Work frequency: ISM 2.4GHz-2
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Bluetooth project: BC4 audio ROM project
Bluetooth chip: BC413159A06
Work frequency: ISM 2.4GHz-2
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Bluetooth project: BC4 audio ROM project
Bluetooth chip: BC413159A06
Work frequency: ISM 2.4GHz-2
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|
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Bluetooth project: BC4 audio ROM project
Bluetooth chip: BC213159A20
Work frequency: ISM 2.4GHz-2
|
|
|
Bluetooth project: BC4 audio ROM project
Bluetooth chip: BC413159A06
Work frequency: ISM 2.4GHz-2
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|
Specifications:
Board layer: 1
Material: FR-4
Minimum board thickness: 0.6mm
Minimum line
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Product Name: Flexible Circuit Board
Model Number: single sided for digital camera
Place of Origin:
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Specifications:
1) 1-layer FPC
2) Base material: Kapton
3) Base copper thickness: 1/3oz. to 2oz
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1/4" COLOR CMOS 300K-PIXEL SENSOR SPECIFICATIONS
Image Device: 1/4" COLOR CMOS HV7131R
Resolution:
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